Journal of Computer Science and Technology ›› 2021, Vol. 36 ›› Issue (5): 1133-1144.doi: 10.1007/s11390-021-0909-8

Special Issue: Computer Architecture and Systems

• Special Section of 2020 CCF Integrated Circuit Design and Automation Conference • Previous Articles     Next Articles

Temperature-Aware Electromigration Analysis with Current-Tracking in Power Grid Networks

Jing Wang, Yi-Ci Cai, Senior Member, CCF, Member, ACM, IEEE, and Qiang Zhou, Senior Member, CCF, Member, ACM, IEEE        

  1. Department of Computer Science and Technology, Tsinghua University, Beijing 100084, China
  • Received:2020-08-15 Revised:2021-08-11 Online:2021-09-30 Published:2021-09-30
  • About author:Jing Wang received her B.S. degree in electrical engineering and automation from China University of Mining and Technology, Beijing, in 2012, and her Master's degree in detection technology and automatic equipment from China University of Mining and Technology, Beijing, in 2016. Currently, she is pursuing her Ph.D. degree in computer science and technology from Tsinghua University, Beijing. Her current research interests include power/ground distribution network analysis and optimization.
  • Supported by:
    This work was supported by the National Natural Science Foundation of China under Grant No. 61774091, and the Key Research and Development Program of China under Grant No. 2019YFB2205001.

Electromigration (EM) is a severe reliability issue in power grid networks. The via array possesses special EM characteristics and suffers from Joule heating and current crowding, closely related to EM violations. In this study, a power grid EM analysis method was developed to solve temperature variation effects for the via array EM. The new method is based on the temperature-aware EM model, which considers the effects of self-heating and thermal coupling of interconnected lines in a power grid. According to the model, the proposed methodology introduces a locality-driven strategy and current tracking to perform full-chip EM assessment for multilayered power grids. The results show that temperature due to Joule heating indeed has significant impacts on the via EM failure. The results further demonstrate that the proposed method might reasonably improve efficiency while ensuring the accuracy of the analysis.

Key words: electromigration (EM); self-heating; thermal coupling; via;

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