SCIE, EI, Scopus, INSPEC, DBLP, CSCD, etc.
Citation: | Bin Xiao, Yi-Fu Zhang, Yan-Ping Gao, Liang Yang, Dong-Mei Wu, Bao-Xia Fan. A Robust and Power-Efficient SoC Implementation in 65nm[J]. Journal of Computer Science and Technology, 2013, 28(4): 682-688. DOI: 10.1007/s11390-013-1368-7 |
[1] |
Borkar S, Karnik T, Narendra S, Tschanz J, Keshavarzi A,De V. Parameter variations and impact on circuits and micro-architecture. In Proc. the 40th Annual Design AutomationConference, Jun. 2003, pp.338-342.
|
[2] |
Karnik T, Borkar S, De V. Sub-90nm technologies: Challengesand opportunities for CAD. In Proc. the 2002 IEEE/ACMInt. Conf. Computer-Aided Design, Nov. 2002, pp.203-206.
|
[3] |
Hu W, Wang R, Chen Y, Fan B, Zhong S, Gao X, Qi Z, YangX. Godson-3B: A 1 GHz 40W 8-core 128GFLOPS processorin 65nm CMOS. In Digest of Technical Papers of 2011 Int.Solid-State Circuits Conference (ISSCC), Feb. 2011, pp.76-78.
|
[4] |
Hu W, Wang J, Gao X, Chen Y, Liu Q, Li G. Godson-3: Ascalable multicore RISC processor with X86 emulation. IEEEMicro, 2009, 29(2): 17-29.
|
[5] |
Fan B, Yang L, Gao Z, Zhang F, Wang R. The implementa-tion and design methodology of a quad-core version Godson-3microprocessor. In Proc. the 52nd IEEE Int. Midwest Symp.Circuits and Systems, Aug. 2009, pp.1167-1170.
|
[6] |
Nassif S R. Within-chip variability analysis. In Technical Di-gest of Int. Electron Devices Meeting, Dec. 1998, pp.283-286.
|
[7] |
Zuchowski P S, Habitz P A, Hayes J D, Oppold J H. Pro-cess and environmental variation impacts on ASIC timing.In Proc. the 2004 IEEE/ACM International Conference onComputer-Aided Design, Nov. 2004, pp.336-342.
|
[8] |
Luo J, Sinha S, Su Q et al. An IC manufacturing yield modelconsidering intra-die variations. In Proc. the 43rd AnnualDesign Automation Conf., Jul. 2006, pp.749-754.
|
[9] |
Keating M, Flynn D, Aitken R, Gibbons A, Shi K. Low PowerMethodology Manual: For System-on-Chip Design. SpringerPublishing Company, Incorporated, 2007.
|
[10] |
Floyd M S, Ghiasi S, Keller T W et al. System power man-agement support in the IBM POWER6 microprocessor. IBMJournal of Research and Development, 2007, 51(6): 733-746.
|
[11] |
Fan Q, Zhang G, Hu W. A synchronized variable frequencyclock scheme in chip multiprocessors. In Proc. IEEE Int.Symp. Circuits and Systems, May. 2008, pp.3410-3413.
|
[12] |
De V, Borkar S. Technology and design challenges for lowpower and high performance. In Proc. the 1999 Int. Symp.Low Power Electronics and Design, Aug. 1999, pp.163-168.
|
[13] |
Kosonocky S V, Bhavnagarwala A J, Chin K et al. Low-power circuits and technology for wireless digital systems.IBM Journal of Research and Development, 2003, 47(2/3):283-298.
|
[14] |
Dai W J. Hierarchical physical design methodology for multi-million gate chips. In Proc. International Symposium onPhysical Design, Apr. 2001, pp.179-181.
|
[15] |
Cong J. Timing closure based on physical hierarchy. In Proc.the 2002 Int. Symp. Physical Design, Apr. 2002, pp.170-174.
|
[16] |
Wang R, Fan B X, Yang L et al. Physical implementation ofthe eight-core Godson-3B microprocessor. Journal of Com-puter Science and Technology, 2011, 26(3): 520-527.
|